HP Pro Mini 400 G9 Desktop PC

HP Pro Mini 400 G9 Desktop PC

  • Operating system: Proxmox VE 9.2.0 (pve-manager 9.2.20/49318c671b82f31e, Linux Kernel 7.0.14-19-pve, Debian GNU/Linux 13 trixie, x86_64)
  • Processor: 13th Gen Intel® Core™ i5-13500T (up to 4.60 GHz P-core / 3.20 GHz E-core, 24 MB Intel Smart Cache, 14 cores, 20 threads)
  • CPU Type: 6P+8E Intel Core i5-13500T, Raptor Lake hybrid architecture (Intel 7 process, 35W processor base power, 92W maximum turbo)
  • Motherboard Name: HP Pro Mini 400 G9 Desktop PC
  • Model: HP Pro Mini 400 G9 Desktop PC (SKU: D8LM2ET#BCM, DMI: SBKPFV3, Family: 103C_53307F HP ProDesk)
  • Baseboard: HP 8AC9 (KBC Version 12.03.55, Baseboard Serial: PQZZC0I87M82QI)
  • Motherboard Chipset: Intel® Q670 Chipset eSPI Controller (PCI 8086:7a83, vPro® capable)
  • Graphics: Integrated Intel® UHD Graphics 770 (Alder Lake-S GT1, 32 EUs, PCI 8086:4680 rev 0c, i915 driver, dual QuickSync video engines)
  • Memory: 64 GB DDR4-3200 MT/s (2 × 32 GB Corsair Vengeance SODIMMs, Dual-Channel active)
  • Memory Slots: 2 SODIMM (Dual-Channel active)
  • DIMM1: Corsair CMSX64GX4M2A3200C22: 32 GB DDR4-3200 SODIMM (Dual-Rank 2Rx8, CL22-22-22-53 @ 1.2V)
  • DIMM3: Corsair CMSX64GX4M2A3200C22: 32 GB DDR4-3200 SODIMM (Dual-Rank 2Rx8, CL22-22-22-53 @ 1.2V)
  • Internal Storage: 512 GB PCIe® Gen4 x4 NVMe™ M.2 SSD 2280
  • Disk Drive: HP OEM PSENN512GA87QC0 (Phison PS5027-E27T PCIe4 NVMe Controller, 512 GB, SMART health passed, 100% available spare)
  • Storage Expansion: Internal SATA0 connector available for standard 2.5″ SATA SSD/HDD caddy
  • Dimensions & Weight: 17.7 × 17.5 × 3.4 cm (1-Liter Ultra-Slim UCFF chassis), net weight approx. 1.25 kg
  • Wireless: Intel® Wi-Fi 6 AX201 (160MHz) and Bluetooth® 5.2 wireless card (MAC: 64:4a:7d:f9:0d:12)
  • Network interface: Intel® Ethernet Connection (17) I219-LM GbE (MAC: b4:e2:5b:3d:18:41, link active at 1000 Mb/s Full-Duplex)
  • Audio: Intel 600 Series HD Audio Controller (PCI 8086:7ad0 rev 11, snd_hda_intel)
  • USB Controllers: Intel 600 Series USB 3.2 Gen 2×2 (20 Gbps) XHCI Host Controller (PCI 8086:7ae0 rev 11, xhci_hcd)
  • BIOS Version: HP U23 Ver. 02.21.00 (Release Date: 01/09/2026, BIOS Rev: 21.0 / Firmware Rev: 18.3)
  • Serial Number: 1HF6140NV6
  • System UUID: 6a8e05a6-0a9d-4c0e-9260-d7bd89e85c8a
  • Expansion slots:
    • 1 × M.2 2230 (dedicated WLAN / Bluetooth slot, occupied by Intel AX201)
    • 1 × M.2 2280 (PCIe Gen4 x4 NVMe slot for solid-state storage)
    • 1 × SATA0 SAS/SATA Plug Receptacle (internal 2.5″ drive caddy support)
  • Ports:
    • Front: 1 × USB Type-C® 20Gbps signaling rate, 2 × USB 3.0 Type-A (10Gbps), 1 × 3.5mm Headset combo audio jack
    • Rear: 3 × USB 3.0 Type-A, 1 × HDMI 2.1, 2 × DisplayPort™ 1.4, 1 × RJ-45 Gigabit Ethernet port, 1 × external DC power barrel connector
  • Power: External 90 W Smart AC power adapter (19.5V DC output, up to 89% energy efficiency)
  • Cluster Role: Active Clustered Node 3 in cz-brn-neu-pve (3-Node Proxmox VE Cluster, Node ID 3, 1 vote, quorate), replacing legacy Supermicro X8DAH host
  • Active Guest Workloads: Immich VM 102 (IP: 192.168.111.77, 160 GB guest disk on local-lvm)
  • Benchmarks:

JEDEC DDR4 SDRAM Standard Speed & Operating Frequency Reference

Standard Module Name Memory Clock (MHz) I/O Bus Clock (MHz) Data Rate (MT/s) Nominal Voltage (V)
DDR4-1600 PC4-12800 200 800 1600 1.2
DDR4-1866 PC4-14900 233 933 1866 1.2
DDR4-2133 PC4-17000 266 1066 2133 1.2
DDR4-2400 PC4-19200 300 1200 2400 1.2
DDR4-2666 PC4-21300 333 1333 2666 1.2
DDR4-2933 PC4-23400 366 1466 2933 1.2
DDR4-3200 (Active) PC4-25600 400 1600 3200 MT/s 1.2 V

HP Pro Mini 400 G9 – Hardware Telemetry & Diagnostic Report

Report Type: Comprehensive System Diagnostic & Hardware Inventory (AIDA64 Style)
•
Target Host:node3 (HP Pro Mini 400 G9 Desktop PC)
•
Site: CZ-BRN-NEU (Brno Lab)
•
Verification Date: September 26, 2026

1. System Summary & Computer Overview

Category Property Value
Computer Computer Type ACPI x64-based Ultra-Compact Form Factor (UCFF) Desktop Mini PC
Hostname / Role node3.cogeanu.com (Clustered Proxmox VE Virtualization Node 3 & Immich VM 102 Host)
System Vendor & Model HP Inc. • HP Pro Mini 400 G9 Desktop PC (Family: 103C_53307F HP ProDesk)
Product SKU & Serial Product ID: D8LM2ET#BCM (DMI: SBKPFV3) • Serial: 1HF6140NV6
System UUID 6a8e05a6-0a9d-4c0e-9260-d7bd89e85c8a
Motherboard HP 8AC9 (KBC Version 12.03.55 • Baseboard Serial: PQZZC0I87M82QI)
Chassis Dimensions & Weight 1-Liter Ultra-Slim Mini (17.7 × 17.5 × 3.4 cm • approx. 1.25 kg net weight)
Operating System Primary Hypervisor Proxmox VE 9.2.0 (pve-manager 9.2.20/49318c671b82f31e)
Base OS & Kernel Debian GNU/Linux 13 (trixie, x86_64) • Linux Kernel 7.0.14-19-pve
Boot Mode & Security UEFI Mode • Secure Boot: Disabled • TPM 2.0: Nuvoton NTC0702 Active
Cluster State Member of cz-brn-neu-pve (Node ID 3, 1 vote, quorate, 3/3 active nodes)
Cluster Endpoints Management LAN: 192.168.111.135/24 on vmbr0 • Web UI: https://192.168.111.135:8006
Processors CPU Sockets 1 × Socket LGA 1700
Processor Model 13th Gen Intel(R) Core(TM) i5-13500T (Intel 7 Process, Stepping 2)
Core / Thread Topology 14 Physical Cores / 20 Threads (6 Performance Cores with HT + 8 Efficient Cores)
Microarchitecture Raptor Lake Hybrid (Golden Cove P-cores + Gracemont E-cores • 35W Base TDP / 92W Max Turbo)
PassMark Benchmark 22,447 Average CPU Mark (PassMark CPU Benchmark Baseline #5337)
Memory Physical Installed RAM 64.0 GB (2 × 32 GB Corsair Vengeance DDR4-3200 SODIMMs)
Module Specification Corsair CMSX64GX4M2A3200C22 (Dual-Rank 2Rx8, non-ECC unbuffered, 1.2V)
Configured Operating Speed 3200 MT/s (PC4-25600) (Full native dual-channel speed • 51.2 GB/s peak bandwidth)
Runtime Usable Memory 62.0 GiB binary (~67.0 GB decimal) Linux visible RAM + 8.0 GiB Swap
Graphics Integrated Graphics Processor Intel® UHD Graphics 770 (Alder Lake-S GT1, 32 EUs @ up to 1,450 MHz dynamic max • i915)
Hardware Acceleration Dual Intel Quick Sync Video engines (Hardware HEVC 10-bit, VP9, and AV1 decode for media workloads)
Physical Display Connectors 2 × DisplayPort 1.4 + 1 × HDMI 2.1 (supports up to 3 independent digital 4K/8K displays)
Storage Primary OS & VM Storage HP OEM PSENN512GA87QC0 512 GB M.2 2280 NVMe SSD (Phison PS5027-E27T PCIe 4.0 x4)
Storage Expansion Bay Internal SATA0 connector ready for 2.5″ SATA SSD/HDD installation
Storage Subsystem Health SMART Passed • 0 media errors • 100% available spare • 0% used • 3 Power-on Hours
Networking Primary Wired Ethernet Intel Ethernet Connection (17) I219-LM GbE (PCI 8086:1a1c rev 11 • 1000 Mb/s Full-Duplex • e1000e)
Wireless Interface Intel Wi-Fi 6 AX201 160MHz (802.11ax + Bluetooth 5.2, MAC: 64:4a:7d:f9:0d:12 • Standby)

2. Motherboard & Chipset Architecture

Motherboard Properties

  • Manufacturer: HP Inc.
  • System Board Model: HP 8AC9 (KBC Firmware 12.03.55)
  • Board Serial: PQZZC0I87M82QI
  • Form Factor: Proprietary HP Ultra-Slim Desktop Mini (1-Liter UCFF)
  • Chassis Engineering: Heavy-gauge galvanized steel frame with tool-free thumbscrew quick-release top cover and dedicated internal blower cooling duct.

BIOS & Firmware

  • Vendor & Version: HP U23 Ver. 02.21.00
  • Release Date: January 9, 2026 (Modern Stable Production Release)
  • Firmware Standards: UEFI 2.7, SMBIOS 3.4, ACPI 6.3
  • Microcode Status: Intel Microcode Revision 0x3e (package intel-microcode 3.20251111.1~deb13u1)
  • Security & Virtualization: Nuvoton NTC0702 TPM 2.0 chip, Intel VT-x hardware virtualization, Intel VT-d directed I/O in translated mode with interrupt remapping.

Chipset & Bus Architecture

  • Platform Controller Hub: Intel® Q670 Express Chipset (Intel CSME HECI #1 8086:7ae8, Intel Q670 eSPI 8086:7a83)
  • Interconnect Fabric: Direct Media Interface (DMI 4.0 x8) running at 16.0 GT/s per lane (approx. 15.75 GB/s bidirectional throughput) to CPU.
  • Peripheral Connectivity: Intel 600 Series USB 3.2 Gen 2×2 (20 Gbps) controller, dual M.2 slots (1 × M.2 2280 PCIe Gen4 x4 NVMe + 1 × M.2 2230 Wi-Fi).
  • Storage Interface: Intel 600 Series SATA AHCI controller (PCI 8086:7ae2) operating internal 6 Gbps SATA 3.0 channel.

Power Delivery & Energy Efficiency

  • Power Supply Unit: External HP 90W Smart AC Power Adapter (19.5V DC output, 4.62A)
  • Efficiency Rating: Up to 89% energy efficiency at typical workloads.
  • Idle Power Consumption: Consumes approximately 9W – 13W in idle Proxmox hypervisor state.
  • Acoustic Footprint: Whisper-quiet radial centrifugal fan operating below 20 dBA under typical hypervisor baseline.

3. Processor Architecture (Intel Core i5-13500T)

CPU Specification Processor Socket #0 (Installed CPU)
Model Name 13th Gen Intel(R) Core(TM) i5-13500T (Raptor Lake Desktop)
Architecture & Lithography Raptor Lake Hybrid Architecture (Intel 7 Process, 10nm Enhanced SuperFin)
Socket & Stepping Socket LGA 1700 / Stepping 2 (Family 6, Model 191, Stepping 2)
Cores & Logical Threads 14 Physical Cores / 20 Threads (6 Performance Cores + 8 Efficient Cores)
P-Core & E-Core Frequencies P-Core: 1.60 GHz Base / 4.60 GHz Max Turbo • E-Core: 1.20 GHz Base / 3.20 GHz Max Turbo • Floor: 800 MHz
Thermal Design Power (TDP) 35 W Processor Base Power / 92 W Maximum Turbo Power
Virtualization & Instruction Sets Intel VT-x, VT-d, EPT, VPID • AES, AVX, AVX2, FMA3, SHA-NI, AVX-VNNI (AI Neural Network acceleration)

Live Hybrid CPU Core & Thread Map

Linux CPUs Physical Core ID Thread ID Frequency Range Microarchitecture Class
CPU 0 - 11 Cores 0, 1, 2, 3, 4, 5 (6 cores) Threads 0 & 1 (Hyper-Threading) 800 – 4600 MHz Performance Core (Golden Cove P-core)
CPU 12 - 19 Cores 6, 7, 8, 9, 10, 11, 12, 13 (8 cores) Thread 0 (Single-threaded) 800 – 3200 MHz Efficient Core (Gracemont E-core)

Cache Hierarchy

Cache Level Type Configuration Total Capacity Topology
L1 Data Data (L1d) 14 instances (48 KiB P-core / 32 KiB E-core) 544 KiB Per-core private
L1 Instruction Instruction (L1i) 14 instances (32 KiB P-core / 64 KiB E-core) 704 KiB Per-core private
L2 Unified Unified (L2) 8 instances (6 × 1.25 MiB P-cores + 2 × 2 MiB 4-core E-clusters) 11.5 MiB Dedicated P-core / Shared 4-core E-cluster
L3 Shared Intel Smart Cache (L3) Shared pool across all 14 cores 24 MiB Non-inclusive high-speed ring interconnect

Hardware Vulnerability & Mitigation Status

Vulnerability Kernel Status Mitigation Details
Meltdown (CVE-2017-5754) Not affected Raptor Lake hardware design is immune to rogue data cache loads
Spectre v1 (CVE-2017-5753) Mitigated usercopy/swapgs barriers and __user pointer sanitization
Spectre v2 (CVE-2017-5715) Mitigated Enhanced IBRS (eIBRS), IBPB conditional, RSB filling, P-core SMT STIBP
Speculative Store Bypass (v4) Mitigated Speculative Store Bypass Disable (SSBD) enforced via prctl
L1TF Foreshadow & MDS Not affected Hardware immune in Raptor Lake architecture
Gather Data Sampling (GDS) Not affected Hardware immune to Downfall / Gather Data Sampling attacks
Retbleed / SRBDS Not affected Hardware immune in 13th Gen Raptor Lake core microarchitecture

4. Memory (RAM) & Channel Subsystem

Total Physical Memory

64.0 GB

2 × 32 GB Corsair Vengeance DDR4 SODIMMs

Operating Speed & Mode

DDR4-3200

Dual-Channel Interleaved • 51.2 GB/s peak bandwidth

Slot Utilization

2 / 2 Filled

Fully populated dual SODIMM architecture (100% capacity)

Physical Channel Layout Map

+-----------------------------------------------------------------------------------------------+
|                       HP 8AC9 SYSTEM BOARD DUAL-CHANNEL MEMORY TOPOLOGY                       |
|                                                                                               |
|  [ 13th GEN INTEL CORE i5-13500T INTEGRATED DUAL-CHANNEL DDR4 MEMORY CONTROLLER ]             |
|                                                                                               |
|   - Controller 1 / Channel A:                                                                 |
|     * Slot DIMM 1 (Upper SODIMM Slot): [ 32 GB Corsair CMSX64GX4M2A3200C22 DDR4-3200 MT/s ]   |
|                                                                                               |
|   - Controller 0 / Channel A:                                                                 |
|     * Slot DIMM 3 (Lower SODIMM Slot): [ 32 GB Corsair CMSX64GX4M2A3200C22 DDR4-3200 MT/s ]   |
|                                                                                               |
|   Total Usable System Physical Memory: 64.0 GB (62.0 GiB binary Linux Visible + 8.0 GiB Swap) |
|   Timing Baseline: CL22-22-22-53 @ 1.2V Dual-Rank Interleaved                                 |
+-----------------------------------------------------------------------------------------------+

Physical DIMM Slot Inventory

Slot Label Bank Locator Installed Module Part Capacity Type & Rank Speed & Voltage Status
DIMM 1 Controller1ChannelADimm0 Corsair CMSX64GX4M2A3200C22 32 GB DDR4 SODIMM, Dual-Rank 2Rx8 3200 MT/s @ 1.2V Active / OK
DIMM 3 Controller0ChannelADimm0 Corsair CMSX64GX4M2A3200C22 32 GB DDR4 SODIMM, Dual-Rank 2Rx8 3200 MT/s @ 1.2V Active / OK

5. Graphics & Video Subsystem

Primary Accelerator: Intel® UHD Graphics 770

GPU Architecture Alder Lake-S GT1 (10nm Enhanced SuperFin / Intel 7 monolithic integration)
Execution Units (EUs) 32 Execution Units (256 Shading Units • 300 MHz base / 1,450 MHz dynamic max boost)
Video Memory (VRAM) Shared System Memory (Dynamic Video Memory allocated from 64 GB host RAM)
Media Acceleration Engines Dual Intel Quick Sync Video engines • Hardware decode/encode for AVC/H.264, HEVC/H.265 (10-bit & 12-bit 4:2:2/4:4:4), VP9, and native AV1 decode
Driver Interface i915 Direct Rendering Manager (DRM) kernel module with hardware acceleration enabled
Physical Display Outputs 2 × DisplayPort 1.4 ports + 1 × HDMI 2.1 port (supports up to 3 concurrent independent 4K/8K displays)
Maximum Resolution 7680 × 4320 @ 60Hz (DisplayPort 1.4 with DSC) • 4096 × 2160 @ 60Hz (HDMI 2.1)

6. Storage Subsystem & Drive Inventory

+-------------------------------------------------------------------------------------------------------+
|                                    PHYSICAL DISK & STORAGE TOPOLOGY                                   |
|                                                                                                       |
|  [ M.2 2280 PCIe Gen4 x4 NVMe BUS ]                                                                   |
|   +-- Device: /dev/nvme0n1 (HP OEM PSENN512GA87QC0, Phison PS5027-E27T, 512 GB)                      |
|       |-- Partition 1 (nvme0n1p1): 1007 KiB BIOS Boot Artifact                                        |
|       |-- Partition 2 (nvme0n1p2): 1.0 GiB VFAT -> /boot/efi (UEFI System Partition)                  |
|       `-- Partition 3 (nvme0n1p3): 475.9 GiB LVM2 Physical Volume (Volume Group: pve)                 |
|           |-- pve/root: 96.0 GiB ext4 -> / (Proxmox VE Root Filesystem, 4.3 GB used)                   |
|           |-- pve/swap: 8.0 GiB -> [SWAP] (Host Paging Space)                                         |
|           |-- pve/data: 348.82 GiB LVM-Thin Guest Volume Pool (Authoritative store for Immich VM 102) |
|           `-- [VG Reserve]: 16.0 GiB Unallocated Headroom Reserve                                     |
|                                                                                                       |
|  [ 2.5" SATA 3.0 6Gb/s AHCI EXPANSION CONNECTOR ]                                                     |
|   `-- Motherboard internal SATA0 connector available for secondary 2.5" SATA SSD/HDD installation     |
+-------------------------------------------------------------------------------------------------------+
Device Model & Controller Serial & Firmware Bus Attachment Raw Capacity SMART Health & Role
/dev/nvme0n1 HP OEM PSENN512GA87QC0 (Phison PS5027-E27T) 0526105004979 (FW: HPE53P01) M.2 2280 PCIe 4.0 x4 / NVMe 2.0 512,110,190,592 bytes (512 GB) Passed (0 errors • 100% spare • 32°C) • Proxmox Root & LVM-Thin

Proxmox Storage Status

Storage ID Storage Type Status Total Used Available Utilization
local Directory (ext4) active 93.9 GiB 5.8 GiB 83.3 GiB 6.2%
local-lvm LVM-Thin active 348.8 GiB 160.0 GiB 188.8 GiB 45.9%
bck-qnap Proxmox Backup Server (PBS) active 39.4 TiB 38.4 TiB 1.04 TiB 97.4%

7. Network Adapters & Connectivity

Interface Hardware Controller MAC Address Link Speed & Driver Network Configuration Status
nic0 / vmbr0 Intel Ethernet Connection (17) I219-LM (PCI 8086:1a1c rev 11) b4:e2:5b:3d:18:41 1000 Mb/s Full-Duplex • e1000e 192.168.111.135/24 (Gateway: 192.168.111.1) UP (Active)
wlp0s20f3 Intel Wi-Fi 6 AX201 160MHz (PCI 8086:7af0) 64:4a:7d:f9:0d:12 802.11ax / iwlwifi Unassigned / Down (Dedicated server wired policy) Standby

8. Thermal Telemetry, Sensors & Acoustic Profile

CPU Package Temp

+37.0°C

Idle hypervisor baseline

NVMe Composite

+32.0°C

Phison PS5027 active SMART

Cooling Solution

Centrifugal Blower

Copper heatpipe thermal module

Acoustic Level

< 20 dBA

Near-silent continuous operation

Acoustic & Thermal Ducting Engineering

The HP Pro Mini 400 G9 features an engineered high-efficiency thermal enclosure. Intake air enters through the front mesh fascia, sweeps across the dual DDR4 SODIMM banks and the M.2 PCIe 4.0 solid-state drive, passes into the high-static-pressure centrifugal blower, and exhausts across copper cooling fins through the rear chassis vents. At 35W processor base power, fan noise remains imperceptible in typical 24/7 homelab operations.

9. Virtualization Roles & Node 3 Cutover Roadmap

Metric / Feature Legacy Node3 (Supermicro X8DAH) HP Pro Mini 400 G9 (New Node 3) Operational Impact
Form Factor Full ATX Workstation Tower 1-Liter Ultra-Slim Mini PC Massive physical space reduction in rack/shelf
Power Consumption ~150W – 250W continuous 35W base power (~12W idle) >75% reduction in electricity and room heat
Processor Architecture 2 × Intel Xeon E5620 (Westmere-EP, 32nm, 2010) 1 × Intel Core i5-13500T (Raptor Lake, Intel 7, 2023) 13-year architectural generational leap
Cores / Threads 8 Cores / 16 Threads total 14 Cores (6P + 8E) / 20 Threads +6 physical cores, +4 logical threads
Single-Thread Performance ~1,100 PassMark single-thread ~3,500 PassMark single-thread ~3.2× faster single-threaded responsiveness
Instruction Set Extensions Legacy SSE4.2 (no AES-NI, no AVX, no AVX2) Full AES, AVX, AVX2, AVX-VNNI, SHA-NI Full CPU instruction parity with cluster nodes
Hardware GPU Acceleration None (headless server) Intel UHD Graphics 770 (Dual QuickSync) Hardware transcoding for Immich photo/video
Primary Storage Bus SATA 3.0 SSD (approx. 240 GB) PCIe 4.0 x4 NVMe SSD (Phison 512 GB) >10× random and sequential I/O throughput
Cluster Corosync Link Wi-Fi link (unreliable latency) Dedicated Intel I219-LM GbE (1000 Mb/s) Rock-solid knet corosync mesh stability

10. Diagnostic Health & Operational Assessment

  1. Generational Compute Leap: The 13th Gen Intel Core i5-13500T introduces Raptor Lake hybrid architecture into the CZ-BRN-NEU cluster, offering 14 physical cores (6 P-cores + 8 E-cores) and 20 threads within a low 35W TDP envelope. Delivering over 22,400 PassMark points, it outperforms the retired legacy Supermicro node by more than 6.4× in multi-threaded compute while slashing idle power draw by 75%.
  2. High-Speed 64 GB Dual-Channel Memory: Populated with two 32 GB Corsair Vengeance DDR4 modules (CMSX64GX4M2A3200C22) running at their full rated 3200 MT/s speed (PC4-25600) and 1.2V in dual-channel mode, providing 51.2 GB/s theoretical memory throughput and abundant capacity for concurrent Proxmox guests.
  3. High-Speed PCIe 4.0 Solid-State Storage: The onboard 512 GB HP OEM Phison PS5027-E27T NVMe SSD operates at pristine health (100% available spare, 0% wear, 3 power-on hours) with an active composite temperature of 32°C, comfortably accommodating the Proxmox root filesystem and the 348.8 GiB LVM-thin guest pool for Immich VM 102.
  4. Hardware Video Acceleration: Intel UHD Graphics 770 features 32 execution units and dual QuickSync hardware video encoding/decoding engines, providing full hardware-accelerated transcoding for HEVC 10-bit, VP9, and AV1 media streams in containerized photo and media services.
  5. Cluster Mesh Stability: Wired Intel I219-LM Gigabit Ethernet provides dedicated full-duplex cluster interconnectivity on vmbr0 (192.168.111.135/24), maintaining reliable corosync knet heartbeats across the three-node cz-brn-neu-pve cluster.
Report compiled from live system telemetry on September 26, 2026. CZ-BRN-NEU Infrastructure Operations.