Intel Xeon E5-2698 v3 (135W) Haswell-EP

Intel Xeon E5-2698 v3 Processor

Exhibit Type: Enterprise Hardware Specification & Architectural Dossier
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Microarchitecture: Haswell-EP (22 nm)
•
Socket: Socket R3 (LGA 2011-v3 / FCLGA2011-3)
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Museum Inventory: 2 Units (Verified SR1XE / C1 Stepping) Installed in HPE ProLiant DL380 Gen9
•
Source Authority: TechPowerUp, Intel Ark & PassMark

1. Technical Overview & Key Specifications

Category Property Specification
Processor Identity Model Name Intel® Xeon® Processor E5-2698 v3 (SKU: 81903 • PassMark ID: 2368)
Microarchitecture Haswell-EP (Xeon E5-2600 v3 Family)
Market Segment Server / High-End Workstation (Up to 2-socket SMP configuration)
Launch Date / Status September 8, 2014 (Q3’14 launch • MSRP $3,226 USD • End-of-Life)
Part Numbers / S-Spec SR1XE (C1 stepping • Verified Museum Inventory: 2 units in HPE DL380 Gen9)
Physical & Manufacturing CPU Socket Socket R3 (LGA 2011-v3 / FCLGA2011-3, 2011 contacts, FC-LGA12A package)
Manufacturing Process 22 nm 3D Tri-Gate High-k Metal Gate (Intel Foundry)
Transistor Count 5.69 Billion transistors (Haswell-EP HCC monolithic die)
Die Surface Area 662 mm² (High Core Count die with 16 of 18 cores enabled)
Cores & Performance Physical Cores / Threads 16 Cores / 32 Threads (Intel Hyper-Threading Technology)
Base Clock Frequency 2.30 GHz (2300 MHz)
Max Turbo Frequency Up to 3.60 GHz (Intel Turbo Boost Technology 2.0)
All-Core Turbo Frequency 2.80 GHz sustained across all 16 cores simultaneously
Base Clock / Multiplier 100 MHz BCLK / 23.0× (Multiplier Locked)
Bus Interconnect Dual Intel® QuickPath Interconnect (QPI) links at 9.60 GT/s
Thermal & Electrical Thermal Design Power (TDP) 135 W
Nominal Operating Voltage 0.65 V – 1.30 V (FIVR – Fully Integrated Voltage Regulator)
Thermal Specification (Tcase) 88.0 °C
Cache Hierarchy Level 1 (L1) Cache 64 KB per core (32 KB Data + 32 KB Instruction) • 1,024 KB (1 MB) Total
Level 2 (L2) Cache 256 KB dedicated per core • 4,096 KB (4 MB) Total
Level 3 (L3) Cache 40 MB Intel® Smart Cache (shared dual-ring pool across all active cores)
Memory Controller Memory Topology Quad-Channel DDR4 memory interface (4 discrete 64-bit channels)
Supported Memory Types DDR4-1600 / DDR4-1866 / DDR4-2133 MT/s
Max Capacity & Bandwidth Up to 768 GB (RDIMM) / up to 1.5 TB (LRDIMM) • 68.3 GB/s max theoretical bandwidth
Reliability & Formats Advanced ECC, Chipkill / SDDC, RDIMM, LRDIMM, NVDIMM (Persistent Memory)
PassMark Benchmarks Average CPU Mark (Multithread) 18,847 (Median: 19,890 across 236 low-margin samples • Tier List recorded: 18,835)
Single Thread Rating 1,932 MOps/Sec
Server CPU Category Rank Rank #504 out of 1,261 Server CPUs in PassMark database (Top 8.4% multithread overall)
Expansion & Graphics PCI Express Interface PCI-Express Revision 3.0 (Gen 3) direct CPU root complex • 40 Lanes
Integrated Graphics Engine None (N/A • requires discrete GPU accelerator or host BMC video adapter)

2. Silicon Topology & Haswell-EP Microarchitecture

Compute Die Scale

5.69B

Transistors across 662 mm² 22 nm HCC monolithic die

Physical Execution Engines

16 Cores / 32 Threads

2.30 GHz base / 2.80 GHz all-core turbo / 3.60 GHz max turbo

Shared Last Level Cache

40 MB

Smart Cache distributed across dual bi-directional ring buses

Internal Silicon Die Topology & Dual Ring Interconnect

+---------------------------------------------------------------------------------------------------+
|               INTEL XEON E5-2698 v3 SILICON TOPOLOGY (HASWELL-EP HCC 22nm DIE)                    |
|                                                                                                   |
|             [ RING 0 DOMAIN / NUMA NODE 0 ]               [ RING 1 DOMAIN / NUMA NODE 1 ]         |
|                                                                                                   |
|         +-------------+       +-------------+         +-------------+       +-------------+       |
|         |   CORE 0    |       |   CORE 1    |         |   CORE 8    |       |   CORE 9    |       |
|         | 32K+32K L1  |       | 32K+32K L1  |         | 32K+32K L1  |       | 32K+32K L1  |       |
|         |   256K L2   |       |   256K L2   |         |   256K L2   |       |   256K L2   |       |
|         +------+------+       +------+------+         +------+------+       +------+------+       |
|                |                     |                       |                     |              |
|         == ring stop ============= ring stop ==       == ring stop ============= ring stop ==     |
|         ||     |                     |       ||       ||     |                     |       ||     |
|         ||  2.5MB L3              2.5MB L3   || <---> ||  2.5MB L3              2.5MB L3   ||     |
|         ||                                   || TOP   ||                                   ||     |
|         ||  RING 0 (BIDIRECTIONAL LOOP)      || BRIDGE||  RING 1 (BIDIRECTIONAL LOOP)      ||     |
|         ||                                   ||       ||                                   ||     |
|         ||  2.5MB L3              2.5MB L3   || <---> ||  2.5MB L3              2.5MB L3   ||     |
|         ||     |                     |       ||       ||     |                     |       ||     |
|         == ring stop ============= ring stop ==       == ring stop ============= ring stop ==     |
|                |                     |                       |                     |              |
|         +------+------+       +------+------+         +------+------+       +------+------+       |
|         |   CORE 2    |       |   CORE 3    |         |   CORE 10   |       |   CORE 11   |       |
|         | 32K+32K L1  |       | 32K+32K L1  |         | 32K+32K L1  |       | 32K+32K L1  |       |
|         |   256K L2   |       |   256K L2   |         |   256K L2   |       |   256K L2   |       |
|         +-------------+       +-------------+         +-------------+       +-------------+       |
|                                                                                                   |
|         +-------------+       +-------------+         +-------------+       +-------------+       |
|         |   CORE 4    |       |   CORE 5    |         |   CORE 12   |       |   CORE 13   |       |
|         | 32K+32K L1  |       | 32K+32K L1  |         | 32K+32K L1  |       | 32K+32K L1  |       |
|         |   256K L2   |       |   256K L2   |         |   256K L2   |       |   256K L2   |       |
|         +------+------+       +------+------+         +------+------+       +------+------+       |
|                |                     |                       |                     |              |
|         == ring stop ============= ring stop ==       == ring stop ============= ring stop ==     |
|         ||     |                     |       ||       ||     |                     |       ||     |
|         ||  2.5MB L3              2.5MB L3   || <---> ||  2.5MB L3              2.5MB L3   ||     |
|         ||                                   || BOTTOM||                                   ||     |
|         ||  RING 0 (LOWER HALF)              || BRIDGE||  RING 1 (LOWER HALF)              ||     |
|         ||                                   ||       ||                                   ||     |
|         ||  2.5MB L3              2.5MB L3   || <---> ||  2.5MB L3              2.5MB L3   ||     |
|         ||     |                     |       ||       ||     |                     |       ||     |
|         == ring stop ============= ring stop ==       == ring stop ============= ring stop ==     |
|                |                     |                       |                     |              |
|         +------+------+       +------+------+         +------+------+       +------+------+       |
|         |   CORE 6    |       |   CORE 7    |         |   CORE 14   |       |   CORE 15   |       |
|         | 32K+32K L1  |       | 32K+32K L1  |         | 32K+32K L1  |       | 32K+32K L1  |       |
|         |   256K L2   |       |   256K L2   |         |   256K L2   |       |   256K L2   |       |
|         +-------------+       +-------------+         +-------------+       +-------------+       |
|                                                       [2 Harvested / Disabled Die Cores]          |
|                                                                                                   |
|  [ SYSTEM AGENT / CONTROLLER 0 ]                       [ SYSTEM AGENT / CONTROLLER 1 ]            |
|   - Home Agent 0 (HA0) & DDR4 Ch 0/1                    - Home Agent 1 (HA1) & DDR4 Ch 2/3        |
|   - QPI Link 0 (9.60 GT/s coherent link)                - QPI Link 1 (9.60 GT/s coherent link)    |
|   - PCIe Gen3 Root Complex (40 Lanes total)             - Cluster-on-Die (COD) Low-Latency Mode   |
+---------------------------------------------------------------------------------------------------+

Dual Ring Architecture & Cluster-on-Die (COD) Mode

The Haswell-EP High Core Count (HCC) silicon represents Intel’s architectural transition from single-ring buses to a segmented dual ring topology. To prevent ring traffic congestion and unmanageable cache-hop latencies across 16 active cores, the silicon is organized into two independent bi-directional ring loops connected by buffered switches at the top and bottom. Under Cluster-on-Die (COD) mode, the operating system views each socket as two distinct NUMA domains, mapping 8 physical cores, 20 MB of L3 cache, and two memory channels to each domain, significantly reducing inter-ring memory access latency.

3. Quad-Channel DDR4 Subsystem & Dual 9.60 GT/s QPI Links

Integrated Quad-Channel DDR4

  • Generational Leap: Haswell-EP marks the historic enterprise debut of DDR4 memory, reducing nominal supply voltage from 1.50V (DDR3) down to 1.20V.
  • Memory Channels: 4 discrete 64-bit channels integrated into two internal memory controllers (MC0 and MC1).
  • Peak Bandwidth: Up to 68.3 GB/s throughput at DDR4-2133 MT/s, delivering substantial bandwidth to feed all 16 execution cores.
  • Massive Capacity: Supports up to 768 GB registered RDIMMs or up to 1.5 TB with 3DS load-reduced LRDIMMs per physical processor.
  • Enterprise Resilience: Advanced ECC, Single Device Data Correction (SDDC / Chipkill), Demand and Patrol Scrubbing, and Memory Online Spare support.

Dual 9.60 GT/s QPI Interconnect

  • Interconnect Speed: Dual Intel® QuickPath Interconnect links operating at the maximum Haswell-EP rate of 9.60 GT/s (Gigatransfers per second).
  • Theoretical Bandwidth: 38.4 GB/s theoretical bi-directional bandwidth per link, yielding an aggregate inter-socket throughput of 76.8 GB/s.
  • Coherent Multi-Processing: Enables symmetric multiprocessing (2S SMP) with minimal NUMA cross-socket latency penalty.
  • Home Agent Snoop Modes: Supports Early Snoop (ES), Home Snoop (HS), and Cluster-on-Die (COD) snooping protocols to optimize workload cache coherency.

4. Advanced Technologies, AVX2 / FMA3 Vector Compute & Virtualization

Technology Category Feature / Instruction Set Functional Capability
Hardware Virtualization Intel® VT-x Hardware virtualization assistance with Extended Page Tables (EPT) for ultra-low hypervisor memory translation overhead
Intel® VT-d Virtualization for Directed I/O (direct PCI device assignment and DMA remapping for compute GPUs, HBAs, and 10GbE NICs)
Hyper-Threading (HTT) Enables 32 simultaneous execution contexts from 16 physical processing cores, doubling thread density
Vector & Crypto Acceleration Intel® AVX2 & FMA3 Advanced Vector Extensions 2.0 with 256-bit integer vectors and Fused Multiply-Add 3, doubling peak theoretical FLOPs over AVX
Intel® AES-NI & CLMUL Hardware-accelerated AES encryption and Carry-Less Multiplication for wire-speed VPNs and encrypted ZFS storage pools
BMI1, BMI2 & F16C Bit manipulation instructions and half-precision floating-point conversion routines for machine learning data formats
Platform Security & Power Intel® TXT & XD bit Trusted Execution Technology and Execute Disable Bit memory buffer protection against malicious execution attacks
Intel® Turbo Boost 2.0 Dynamic multi-step frequency scaling boosting clock speeds from 2.30 GHz base to 2.80 GHz all-core and 3.60 GHz max turbo
Intel® FIVR & EIST Fully Integrated Voltage Regulator with Enhanced SpeedStep enabling millisecond-granularity per-core power state transitions

5. PassMark Benchmark Dossier & Synthetic Performance (PerformanceTest V10)

Multithread Rating (CPU Mark)

18,847

Median: 19,890 across 236 samples (Low margin for error)

Single Thread Rating

1,932

Single-core execution throughput (MOps/Sec)

Data Encryption (AES-NI)

5,812

MBytes/Sec sustained hardware cryptographic throughput

PassMark PerformanceTest V10 Detailed Test Suite Results

Test Suite Routine Average Result Metric Operational Context
Integer Math 80,604 MOps/Sec General core processing & hypervisor kernel scheduling
Floating Point Math 40,243 MOps/Sec Mathematical modeling, scientific compute & graphics rendering
Find Prime Numbers 86 Million Primes/Sec Pure 16-core integer compute pipeline throughput
Random String Sorting 44,388 Thousand Strings/Sec DDR4 memory controller & 40 MB L3 cache indexing efficiency
Data Encryption 5,812 MBytes/Sec Hardware AES-NI encrypted ZFS arrays & multi-gigabit IPsec/WireGuard VPNs
Data Compression 335,889 KBytes/Sec Real-time ZFS LZ4 compression & Proxmox backup archival pipelines
Physics Simulation 1,126 Frames/Sec Real-time dynamic physics across 32 concurrent execution threads
Extended Instructions 19,739 Million Matrices/Sec Intel AVX2 & FMA3 256-bit vectorized matrix transformations
Single Thread Performance 1,932 MOps/Sec Single-core serial latency and interactive management console responsiveness

PassMark Relative Hierarchy: Haswell-EP Stack

Processor Model Cores / Frequency Average CPU Mark Relative Variance
Intel Xeon E5-2699 v3 18C / 36T @ 2.30 GHz 19,301 +2.4%
Intel Xeon E5-2698 v3 (Exhibit #2617) 16C / 32T @ 2.30 GHz 18,847 Baseline (0.0%)
Intel Xeon E5-2697 v3 14C / 28T @ 2.60 GHz 17,614 -6.5%
Intel Xeon E5-2690 v3 12C / 24T @ 2.60 GHz 15,892 -15.7%
Intel Xeon E5-2680 v3 12C / 24T @ 2.50 GHz 15,310 -18.8%
Intel Xeon E5-2670 v3 12C / 24T @ 2.30 GHz 14,198 -24.7%
Intel Xeon E5-2650 v3 10C / 20T @ 2.30 GHz 12,385 -34.3%
Intel Xeon E5-2620 v3 6C / 12T @ 2.40 GHz 7,215 -61.7%

6. Platform Synergy: Dual-Socket Deployment in HPE ProLiant DL380 Gen9 Server (Exhibit #2644)

Flagship Enterprise Computing Architecture

The two Intel Xeon E5-2698 v3 processors cataloged in the museum collection are deployed in a symmetric dual-socket (2S SMP) configuration within the HPE ProLiant DL380 Gen9 Server (Exhibit #2644, Serial Number: CZJ7450QBT). Built upon the enterprise Intel C610 (Wellsburg) chipset platform, the dual-processor architecture forms a high-density 32-core / 64-thread compute powerhouse:

Hardware Subsystem Intel Xeon E5-2698 v3 (Per CPU) HPE ProLiant DL380 Gen9 (Exhibit #2644)
CPU Sockets / Compute Socket R3 (LGA 2011-v3) • 16C / 32T @ 2.30 GHz (3.60 GHz Turbo) Dual Sockets (2S SMP) • Combined 32 Cores / 64 Threads linked via dual 9.60 GT/s QPI buses
Cache Capacity 40 MB Intel Smart Cache (dual-ring architecture) Combined 80 MB L3 Smart Cache across dual sockets
Memory Subsystem Quad-Channel DDR4 memory controller (68.3 GB/s peak) 24 DIMM slots fully populated: 768 GB (24 × 32 GB Samsung DDR4-2400 RDIMMs) across 8 memory channels
PCI Express Root Complex 40 lanes PCI Express 3.0 direct root ports Combined 80 PCIe 3.0 lanes feeding secondary riser cards, SAS HBAs, and accelerators
Compute Accelerator Role Host CPU providing high-bandwidth PCIe 3.0 x16 pipeline Houses AMD Instinct MI50 (32 GB HBM2, PCIe 3.0 x16, ROCm/HPC AI accelerator)
Storage Controller Direct PCIe 3.0 root interface for NVMe & RAID HPE Flexible Smart Array P440ar/2GB FBWC 12Gb/s SAS controller driving Intel SSDs and SAS arrays
Management & Power Integrated thermal and power telemetry via PECI / DMI HPE iLO 4 (Firmware v3.40) • Dual redundant HPE 800W Flex Slot Platinum PSUs (96% efficiency)

7. Curator’s Assessment & Homelab Applicability

  1. Museum Hardware Provenance: Mateo’s Museum archive preserves 2 verified physical units of the Intel Xeon E5-2698 v3 processor. Both units feature production S-Spec SR1XE (C1 stepping) and are actively deployed in a balanced dual-socket 2S configuration inside the museum’s flagship HPE ProLiant DL380 Gen9 2U server (Serial: CZJ7450QBT).
  2. Massive 32-Core / 64-Thread Compute Density: Delivering a single-socket Average CPU Mark of 18,847 (median 19,890) and combining into 32 physical cores and 64 execution threads across the dual-socket DL380 Gen9 host, the platform provides immense compute density for dense container orchestration, multi-tenant virtual machines, and Monero RandomX mining (~12.3 kH/s).
  3. Generational Vector Leap (AVX2 & FMA3): Haswell-EP introduced AVX2 and 256-bit Fused Multiply-Add 3, yielding an Extended Instructions score of 19,739 Million Matrices/Sec. This doubles vector compute throughput compared to previous Sandy Bridge and Ivy Bridge generations, making it capable of modern numerical acceleration.
  4. Exceptional Cryptographic & Compression Performance: Dedicated hardware AES-NI instructions achieve 5,812 MB/s in PassMark encryption routines alongside 335,889 KB/s in data compression. This guarantees line-rate ZFS pool LZ4 compression and wire-speed multi-gigabit IPsec/WireGuard VPN encryption without CPU saturation.
  5. Massive Memory Footprint (768 GB DDR4 ECC): Supported by the processor’s quad-channel DDR4 memory controller and fully populated with 24 × 32 GB Samsung RDIMMs in the DL380 Gen9 chassis, the system offers 768 GB of aggregate ECC memory, completely eliminating memory starvation for large in-memory databases and virtualization labs.
  6. Dual 9.60 GT/s QPI & Cluster-on-Die (COD): Operating at Intel’s peak 9.60 GT/s QPI transfer rate and utilizing Cluster-on-Die mode, the processor pair minimizes NUMA cross-socket latency, preserving deterministic memory access times across the complex dual-ring topology.
  7. AI Acceleration Host for AMD Instinct MI50: Serving as the compute host for an AMD Instinct MI50 (32 GB HBM2, ROCm/HPC accelerator), the dual Xeon E5-2698 v3 configuration delivers the PCIe 3.0 bandwidth, NUMA locality, and high-capacity RAM subsystem needed to feed large machine learning models and parallel computational pipelines.
Intel Xeon Processor Specification Dossier compiled for Mateo’s Museum. Source Authority: TechPowerUp CPU Database, Intel Ark & PassMark Software.