Dell Precision T7610 Workstation

Desktop Server

Dell Precision T7610 Workstation – Hardware Telemetry & Diagnostic Report

Report Type: Comprehensive System Diagnostic & Hardware Inventory (AIDA64 Style)
•
Target Host: precision-7610 (Dell Precision 7610 • Service Tag: 4PYLJ32)
•
Site: CZ-BRN-NEU (Brno Lab)
•
Verification Date: September 22, 2026

1. System Summary & Computer Overview

Category Property Value
Computer Computer Type ACPI x64-based Multi-Processor Enterprise Workstation
Hostname / Role precision-7610 (High-Performance Compute & Virtualization Host)
System Vendor Dell Inc.
Product Model Precision T7610 (Precision 7610 Series • Service Tag: 4PYLJ32)
Chassis Form Factor Rackable Full-Tower (5U Rackmount Capable with ReadyRails)
Motherboard Dell Workstation System Board (Part: 0NK70N Rev A04 / Intel C602)
Operating System Deployment State Active Production Host (Ubuntu 22.04.5 LTS, Linux Kernel 6.8.0-138-generic)
Architecture 64-bit (x86_64, Little-Endian)
Target Workload Stack Proxmox VE 8.x / Debian GNU/Linux 13 / Ubuntu 22.04 LTS / Virtualization
Boot Capability UEFI 2.3.1 with Secure Boot support & Legacy BIOS Fallback
Processors CPU Sockets 2 x Socket R (LGA 2011 / FCLGA2011)
Processor Models 2 x Intel(R) Xeon(R) CPU E5-2637 v2 @ 3.50GHz (Exhibit #2969)
Core / Thread Count 8 Physical Cores / 16 Threads total (4 cores / 8 threads per socket)
Microarchitecture Ivy Bridge-EP (22 nm, Stepping 4 / M1, S-Spec SR1B7)
PassMark Benchmark 6,483 Multi-Thread Mark (Single-Thread: 1,939 MOps/Sec)
Memory Physical Installed RAM 256.0 GB (16 x 16 GB Samsung Registered ECC RDIMMs • Exhibit #3103)
Module Specification Samsung M393B2G70DB0-YK0 (D-die) & M393B2G70BH0-YK0 (B-die) (Dual-Rank 2Rx4, PC3L-12800R, CL11, 1.35V/1.5V)
Memory Architecture Dual-Socket Quad-Channel Architecture (16 DIMM slots fully populated, 8 slots per CPU, 1600 MT/s)
Maximum Capacity 256 GB installed (platform supports up to 512 GB with 32 GB LRDIMMs)
Graphics Primary Accelerator HP NVIDIA Quadro K4000 (3 GB GDDR5, 192-bit Bus, PCIe 2.0 x16 • Exhibit #3105)
GPU Architecture Kepler (GK106GL, 768 CUDA Cores @ 810 MHz, 134.4 GB/s Bandwidth)
Display Connectors 2 x DisplayPort 1.2, 1 x Dual-Link DVI-I (Max Resolution: 3840 × 2160 @ 60Hz)
Storage Primary SSD Micron 5210 ION Enterprise SSD (1.92 TB SATA 6Gb/s • Exhibit #3033, S/N 195225C5487B, 968.3 TBW, 56% health)
Primary Controller Integrated LSI SAS 2308 6Gb/s (8 SAS/SATA ports via 2x SFF-8087 mini-SAS)
Secondary Controller Intel C602 AHCI SATA 3.0 6Gb/s (Optical drive MATSHITA DVD+/-RW UJ8E0 on SATA0)
Drive Bays 4 x 3.5″/2.5″ internal quick-release bays + 1 x 5.25″ flex bay + slimline ODD bay
Networking Primary Ethernet Intel 82579LM Gigabit Network Connection (10/100/1000 Mbps, Intel vPro / AMT, active at 192.168.111.106/24)
Secondary Ethernet Intel I210 Gigabit Network Connection (10/100/1000 Mbps, PCIe controller, Standby)
Wireless Adapter Intel Wi-Fi 6 AX200 (802.11ax 2×2 MU-MIMO 160MHz up to 2.4 Gbps, Bluetooth 5.2, PCIe x1 desktop carrier)

2. Motherboard & Chipset Architecture

Motherboard Properties

  • Manufacturer: Dell Inc.
  • Board Model: Precision Workstation T7610 (Part: 0NK70N Rev A04)
  • Chassis Service Tag: 4PYLJ32
  • Sockets: Dual Socket R (LGA 2011 / FCLGA2011)
  • Form Factor: Proprietary Dell Rackable Tower / 5U SSI EEB class
  • Chassis Engineering: Heavy-gauge cold-rolled aluminum chassis with integrated front/rear cast metal carrying handles and lockable tool-free side panel.

BIOS & Firmware

  • Vendor: Dell Inc. / American Megatrends Inc. (AMI)
  • Revision: Version A17 (Release Date: 07/09/2018)
  • ROM Capacity: 8 MB + 4 MB Serial Flash EEPROM (12 MB total SPI NVRAM)
  • Firmware Standards: UEFI 2.3.1, SMBIOS 2.7, ACPI 5.0, PXE 2.1 Boot
  • Hardware Features: Dell Reliable Memory Technology (RMT), Intel Trusted Execution Technology (TXT), Intel VT-x and VT-d Directed I/O Virtualization.

Chipset & Bus Architecture

  • Platform Controller Hub: Intel C602 Express Chipset (Patsburg PCH, 65 nm, 12W TDP)
  • Interconnect Fabric: Dual QuickPath Interconnect (QPI) links operating at 8.00 GT/s (32.0 GB/s bi-directional per link) between CPU0 and CPU1.
  • Direct Media Interface: DMI 2.0 (4 lanes @ 5.0 GT/s, 20 Gb/s total bandwidth) linking CPU1 to the Intel C602 PCH.
  • PCIe Lane Infrastructure: 40 PCI Express 3.0 lanes direct from each CPU socket, providing 80 PCIe lanes total for expansion slots and onboard controllers.

Power Delivery & Regulation

  • Power Supply Unit: Dell 1300W High-Efficiency Modular Power Supply (80 PLUS Gold certified)
  • Voltage Scaling: 1300W output at 181-240 VAC; 1100W output at 108-180 VAC; 1000W output at 100-107 VAC.
  • Tool-Free Servicing: Rear external blind-mate pull handle allowing instant tool-free slide-out PSU replacement.
  • GPU Auxiliary Power: Dedicated PCIe power harness supporting up to 600W total graphics draw (up to four 150W single-slot or two 300W dual-slot accelerators).

3. Processors (Dual Intel Xeon E5-2637 v2)

CPU Specification CPU Socket #0 (CPU 1) CPU Socket #1 (CPU 2)
Model Name Intel(R) Xeon(R) CPU E5-2637 v2 @ 3.50GHz Intel(R) Xeon(R) CPU E5-2637 v2 @ 3.50GHz
Architecture & Lithography Ivy Bridge-EP (22 nm 3D Tri-Gate Transistors) Ivy Bridge-EP (22 nm 3D Tri-Gate Transistors)
Socket & Stepping Socket R (LGA 2011) / Stepping 4 (M1, Family 6, Model 62) Socket R (LGA 2011) / Stepping 4 (M1, Family 6, Model 62)
Production S-Spec Code SR1B7 (Verified Museum Physical Inventory) SR1B7 (Verified Museum Physical Inventory)
Physical Cores / Threads 4 Cores / 8 Threads (Intel Hyper-Threading) 4 Cores / 8 Threads (Intel Hyper-Threading)
Base & Turbo Frequencies 3.50 GHz Base / 3.80 GHz Max Turbo 3.50 GHz Base / 3.80 GHz Max Turbo
Operating Thermals +41.0°C Package (33°C – 41°C Core) +42.0°C Package (37°C – 42°C Core)
Thermal Design Power (TDP) 130 W (High-Frequency Workstation Profile) 130 W (High-Frequency Workstation Profile)
QPI Interconnect Links Dual 8.00 GT/s QPI Links (Coherent Interconnect) Dual 8.00 GT/s QPI Links (Coherent Interconnect)
NUMA Node Association Node 0 (CPUs 0, 1, 2, 3, 8, 9, 10, 11) Node 1 (CPUs 4, 5, 6, 7, 12, 13, 14, 15)

Cache Hierarchy

Cache Level Type Per-Core / Per-Socket Total Aggregate Associativity & Line Size
L1 Data Data (L1d) 32 KiB per core 256 KiB (8 instances across 8 cores) 8-way set associative, 64-byte line size
L1 Instruction Instruction (L1i) 32 KiB per core 256 KiB (8 instances across 8 cores) 4-way set associative, 64-byte line size
L2 Unified Dedicated (L2) 256 KiB per core 2,048 KiB (2 MiB) 8-way set associative, 64-byte line size
L3 Shared Intel Smart Cache (L3) 15,360 KiB (15 MiB) per socket 30,720 KiB (30 MiB) 16-way set associative, non-inclusive ring cache

Hardware Vulnerability & Mitigation Status

Vulnerability Kernel Status Mitigation Details
Meltdown (CVE-2017-5754) Mitigated Kernel Page Table Isolation (KPTI) fully active
Spectre v1 (CVE-2017-5753) Mitigated usercopy/swapgs barriers and __user pointer sanitization
Spectre v2 (CVE-2017-5715) Mitigated Retpolines, conditional Indirect Branch Prediction Barrier (IBPB), IBRS_FW, RSB filling
Speculative Store Bypass (v4) Mitigated Speculative Store Bypass Disable (SSBD) enforced via prctl
L1TF Foreshadow (CVE-2018-3615) Mitigated PTE Inversion, VMX L1D cache flushing on guest entry
MDS (CVE-2019-11091) Mitigated Microcode buffer clearing (MD_CLEAR) active
Retbleed / SRBDS / Downfall (GDS) Not affected Ivy Bridge-EP microarchitecture lacks vulnerable gathering structures / not susceptible

4. Memory (RAM) & NUMA Subsystem

Total Physical Memory

256.0 GB

16 x 16 GB Samsung Registered ECC RDIMMs • Exhibit #3103

DIMM Technology & Speed

DDR3-1600

1,600 MT/s • Dual-Rank (2Rx4) • 102.4 GB/s theoretical per socket

Platform Population

16 / 16 Slots

100% Populated (Expandable to 512 GB with 32 GB LRDIMMs)

NUMA & Channel Physical Layout Map

+-----------------------------------------------------------------------------------------------+
|                             DELL PRECISION T7610 SYSTEM BOARD (0NK70N)                        |
|                                                                                               |
|  [ CPU Socket #0: NUMA Node 0 ]                     [ CPU Socket #1: NUMA Node 1 ]            |
|   Memory Controller #0: 128 GiB                      Memory Controller #1: 128 GiB            |
|   (4 Channels x 2 Slots = 8 DIMM Slots)              (4 Channels x 2 Slots = 8 DIMM Slots)    |
|                                                                                               |
|   - Channel 0:                                       - Channel 0:                             |
|     * Slot DIMM 1 (White): [ 16GB Samsung DB0 2Rx4]    * Slot DIMM 1 (White): [ 16GB Samsung BH0 2Rx4]|
|     * Slot DIMM 2 (Black): [ 16GB Samsung BH0 2Rx4]    * Slot DIMM 2 (Black): [ 16GB Samsung BH0 2Rx4]|
|   - Channel 1:                                       - Channel 1:                             |
|     * Slot DIMM 3 (White): [ 16GB Samsung DB0 2Rx4]    * Slot DIMM 3 (White): [ 16GB Samsung BH0 2Rx4]|
|     * Slot DIMM 4 (Black): [ 16GB Samsung BH0 2Rx4]    * Slot DIMM 4 (Black): [ 16GB Samsung DB0 2Rx4]|
|   - Channel 2:                                       - Channel 2:                             |
|     * Slot DIMM 5 (White): [ 16GB Samsung DB0 2Rx4]    * Slot DIMM 5 (White): [ 16GB Samsung DB0 2Rx4]|
|     * Slot DIMM 6 (Black): [ 16GB Samsung BH0 2Rx4]    * Slot DIMM 6 (Black): [ 16GB Samsung BH0 2Rx4]|
|   - Channel 3:                                       - Channel 3:                             |
|     * Slot DIMM 7 (White): [ 16GB Samsung DB0 2Rx4]    * Slot DIMM 7 (White): [ 16GB Samsung DB0 2Rx4]|
|     * Slot DIMM 8 (Black): [ 16GB Samsung BH0 2Rx4]    * Slot DIMM 8 (Black): [ 16GB Samsung DB0 2Rx4]|
|                                                                                               |
|   Subtotal Node 0: 8 x 16 GB = 128 GB                Subtotal Node 1: 8 x 16 GB = 128 GB      |
+-----------------------------------------------------------------------------------------------+
|             TOTAL SYSTEM PHYSICAL MEMORY: 256.0 GB (16 SLOTS FULLY POPULATED • 1600 MT/s)          |
+-----------------------------------------------------------------------------------------------+

Physical DIMM Slot Inventory (All 16 Slots Populated)

Slot # Locator Installed Module Part Manufacturer Serial Number Capacity Type & Rank Speed & Voltage Status
1 DIMM1_CPU1 M393B2G70DB0-YK0 Samsung 4150C9AB 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
2 DIMM5_CPU1 M393B2G70DB0-YK0 Samsung 4150AD49 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
3 DIMM3_CPU1 M393B2G70DB0-YK0 Samsung 4150AF40 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
4 DIMM7_CPU1 M393B2G70DB0-YK0 Samsung 4150AD48 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
5 DIMM2_CPU1 M393B2G70BH0-YK0 Samsung 3642021F 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
6 DIMM6_CPU1 M393B2G70BH0-YK0 Samsung 364200B8 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
7 DIMM4_CPU1 M393B2G70BH0-YK0 Samsung 364203EC 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
8 DIMM8_CPU1 M393B2G70BH0-YK0 Samsung 3642021E 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 0)
9 DIMM1_CPU2 M393B2G70BH0-YK0 Samsung 364203D3 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
10 DIMM5_CPU2 M393B2G70DB0-YK0 Samsung 4150AF8D 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
11 DIMM3_CPU2 M393B2G70BH0-YK0 Samsung 364203AC 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
12 DIMM7_CPU2 M393B2G70DB0-YK0 Samsung 4150AF8E 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
13 DIMM2_CPU2 M393B2G70BH0-YK0 Samsung 3642011B 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
14 DIMM6_CPU2 M393B2G70BH0-YK0 Samsung 36420341 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
15 DIMM4_CPU2 M393B2G70DB0-YK0 Samsung 4150AF8B 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)
16 DIMM8_CPU2 M393B2G70DB0-YK0 Samsung 4150AF91 16 GB Registered ECC 2Rx4 1600 MT/s / 1.35V Active (Node 1)

5. Graphics & Display Adapters

Primary Accelerator: HP NVIDIA Quadro K4000 3 GB (Exhibit #3105)

The primary graphics subsystem is powered by a genuine enterprise HP OEM NVIDIA Quadro K4000 (HP Spare 713381-001 / Assy 700104-001, vBIOS 80.06.76.00.07). The workstation previously hosted a consumer Gigabyte GeForce GTS 250 (Exhibit #2975) during early barebone testing, which has now transitioned to the museum graphics collection.

GPU Architecture Kepler (GK106GL / 28 nm, Revision A1)
CUDA Cores / Shaders 768 CUDA Cores (4 SMX units @ 810 MHz)
Core Engine Clock 810 MHz
Video Memory (VRAM) 3,072 MiB (3 GB) GDDR5 (192-bit Memory Bus)
Memory Bandwidth 1,404 MHz (5,616 MT/s Effective) • 134.4 GB/s Peak Memory Bandwidth
PassMark G3D Mark 2,718 G3D Mark (Rank 7 in museum GPU Collection)
Host Bus Location PCIe 2.0 x16 negotiated (PCIe 3.0 capable) at Bus 03:00.0 (Root Port 00:02.0, CPU1)
Hardware Identifiers PCI ID 10de:11fa • Subsystem HP 103c:079c • HP Spare 713381-001 • Assy 700104-001
Serial Numbers & Firmware Board S/N: 0322314010635 • HP S/N: CN42404748 • vBIOS: 80.06.76.00.07
Thermal & Power Draw 80 W Max TDP (Single 6-pin PCIe) • Verified Idle: +44.0°C, 2100 RPM, 20.08 W
Physical Display Outputs 2 x DisplayPort 1.2, 1 x Dual-Link DVI-I (Single-slot bracket)
Maximum Resolution 3840 × 2160 @ 60Hz (DisplayPort 1.2) • 2560 × 1600 (Dual-Link DVI)

6. Storage Subsystem & Drive Inventory

+-------------------------------------------------------------------------------------------------------+
|                                    PHYSICAL DISK & ARRAY TOPOLOGY                                     |
|                                                                                                       |
|  [ INTEGRATED LSI SAS 2308 CONTROLLER (PCIe 3.0 x8 at Bus 01:00.0) ]                                  |
|   +-- SAS Port 0 (Mini-SAS SFF-8087 Port 0) -> Internal Drive Bay 0: [ MICRON 5210 ION 1.92TB SSD ]    |
|   +-- SAS Port 1 (Mini-SAS SFF-8087 Port 0) -> Internal Drive Bay 1: [ UNPOPULATED / READY ]           |
|   +-- SAS Port 2 (Mini-SAS SFF-8087 Port 0) -> Internal Drive Bay 2: [ UNPOPULATED / READY ]           |
|   +-- SAS Port 3 (Mini-SAS SFF-8087 Port 0) -> Internal Drive Bay 3: [ UNPOPULATED / READY ]           |
|   `-- SAS Port 4-7 (Mini-SAS SFF-8087 Port 1) -> External Flex-Bay (Optional 4x 2.5" SAS/SATA Caddy) |
|                                                                                                       |
|  [ INTEGRATED INTEL C602 AHCI CONTROLLER (6 Gbps SATA at Bus 00:1f.2) ]                               |
|   +-- SATA0 Connector -----------------------> Slimline Optical Bay: [ MATSHITA DVD+/-RW UJ8E0 ]      |
|   `-- SATA1 Connector -----------------------> 5.25" Device Bay [ UNPOPULATED / READY ]               |
+-------------------------------------------------------------------------------------------------------+
Bay Location Controller Routing Physical Form Factor Interface Speed Installed Device Telemetry / Health
Internal Bay 0 LSI SAS 2308 (SAS0, Port 0) 2.5″ in Tool-Free Caddy SATA 3.2 6.0 Gb/s Micron 5210 ION 1.92TB SSD (Exhibit #3033 • /dev/sda) PASSED (56% Health, 968.3 TBW, 35,803 POH, +32°C)
Internal Bay 1 LSI SAS 2308 (SAS0, Port 1) 3.5″ / 2.5″ Tool-Free Caddy 6 Gbps SAS 2.0 / SATA 3.0 Unpopulated Ready for Storage Array
Internal Bay 2 LSI SAS 2308 (SAS0, Port 2) 3.5″ / 2.5″ Tool-Free Caddy 6 Gbps SAS 2.0 / SATA 3.0 Unpopulated Ready for Storage Array
Internal Bay 3 LSI SAS 2308 (SAS0, Port 3) 3.5″ / 2.5″ Tool-Free Caddy 6 Gbps SAS 2.0 / SATA 3.0 Unpopulated Ready for Storage Array
Flex-Bay 4 LSI SAS 2308 (SAS1) / SATA1 5.25″ Half-Height Bay 6 Gbps SAS / SATA Unpopulated Available Expansion Bay
Optical Bay Intel C602 (SATA0) Slimline Optical Disc Drive 1.5 Gbps AHCI SATA MATSHITA DVD+/-RW UJ8E0 (/dev/sr0) Active / Ready

7. Network Adapters & Connectivity

Interface Hardware Controller Bus Attachment Link Speeds / Specs Enterprise Capabilities Status
LAN 1 (enp0s25) Intel 82579LM Gigabit PHY (Lewisville) Intel C602 Integrated MAC (PCIe 00:19.0) 10 / 100 / 1000 Mbit/s (Auto MDI-X) Intel AMT / vPro, Wake-on-LAN, PXE 2.1 Boot UP (192.168.111.106)
LAN 2 (enp7s0) Intel I210 Gigabit PCIe Controller [8086:1533] Dedicated PCIe 1.1 x1 Bus (07:00.0) 10 / 100 / 1000 Mbit/s (Auto MDI-X) MSI-X Multi-Queue, RSS, Jumbo Frames (9k), Wake-on-LAN Standby (No Carrier)
WLAN 1 (wlp129s0) Intel Wi-Fi 6 AX200 Adapter [8086:2723] PCIe 1.1 x1 (Bus 81:00.0, CPU 2 Root Port) 802.11ax (Wi-Fi 6), 2×2 MU-MIMO 160MHz (2.4 Gbps) Bluetooth 5.2, WPA3-Personal/Enterprise, iwlwifi Active Adapter

8. Thermal Telemetry, Sensors & Fan Subsystem

CPU Heatsinks

+41°C / +42°C

Dual PWM Fans: 990 / 999 RPM

Hard Drive Cooling

+32°C SSD

Direct chassis airflow across Bay 0

GPU Accelerator

+44°C Quadro

Fan: 2100 RPM • 20.08 W Idle Draw

Power Supply Zone

Isolated Tunnel

1300W Gold floor exhaust duct

Acoustic & Airflow Management

The Dell Precision T7610 utilizes a segregated dual-chamber thermal partition. The processor and memory array reside in an isolated top tunnel equipped with clear molded airflow baffles. A separate middle chamber directs positive pressure over the four full-length PCIe x16 graphics slots, while the 1300W modular power supply breathes through an independent floor-level intake duct.

  • Thermal Fan Control: Closed-loop BIOS PID orchestration responding dynamically to CPU digital thermal sensors (PECI) and motherboard ambient thermistors (+23°C inlet / +43°C exhaust).
  • Acoustic Profile: Ultra-quiet idle profile tuned for creative studio environments; scales progressively under compute stress.

9. Operating System & Workload Readiness

Compute & Virtualization Roles

  • Virtualization Host: Proxmox VE 8.x / Debian 13 hypervisor cluster node with hardware Intel VT-x and VT-d PCI passthrough.
  • SMP Compute Node: 8 high-frequency Ivy Bridge cores (3.50 GHz base / 3.80 GHz turbo) with 30 MB L3 cache for compiling, emulation, and batch parallel simulation.
  • Lab Infrastructure: High-bandwidth Intel Gigabit controllers and Wi-Fi 6 AX200 for VLAN segregation, NFS storage transport, and homelab services.

Acceleration & Expansion Potential

  • Workstation Graphics: Dedicated HP NVIDIA Quadro K4000 (3 GB GDDR5, 768 CUDA cores) providing workstation OpenGL/DirectX acceleration and CUDA compute.
  • Massive Memory Footprint: 256.0 GB DDR3-1600 Registered ECC memory across 16 populated DIMMs delivering 102.4 GB/s theoretical bandwidth per socket.
  • Enterprise Storage: Integrated LSI 2308 6Gb/s SAS/SATA controller with Micron 5210 ION enterprise SSD (968.3 TBW, 56% health) and 3 available hot-swap bays.

10. Diagnostic Health & Operational Assessment

  1. Processor Subsystem Health: Both Intel Xeon E5-2637 v2 processors (verified production S-Spec SR1B7, M1 stepping • Exhibit #2969) operate in dual-socket symmetric multiprocessing configuration, delivering 8 physical cores and 16 threads at 3.50 GHz base / 3.80 GHz turbo with 30 MB aggregate L3 cache and dual 8.0 GT/s QPI links in full operational order at +41.0°C / +42.0°C thermals.
  2. Memory Architecture & NUMA Balance: The 256.0 GB Samsung Registered ECC memory subsystem (Exhibit #3103) is 100% populated across all 16 slots with 8x M393B2G70DB0-YK0 (D-die) and 8x M393B2G70BH0-YK0 (B-die) modules, delivering a balanced 128 GB per NUMA node at full 1600 MT/s quad-channel bandwidth backed by Dell Reliable Memory Technology (RMT).
  3. Graphics & Compute Acceleration: Dedicated HP NVIDIA Quadro K4000 3 GB graphics accelerator (768 CUDA cores, 3 GB GDDR5, 192-bit bus, 2,718 G3D Mark • Exhibit #3105) provides workstation multi-display output (2x DP 1.2, 1x DVI-I) and CUDA acceleration, replacing the former test GTS 250 with full enterprise driver support.
  4. Storage & Connectivity Infrastructure: The primary storage volume is anchored by a high-end Micron 5210 ION 1.92 TB SSD (Exhibit #3033) via integrated LSI SAS 2308 6Gb/s controller (35,803 POH, 968.3 TBW, 56% health remaining), complemented by dual Gigabit Intel Ethernet (82579LM + I210) and an Intel Wi-Fi 6 AX200 wireless adapter.
Report compiled from live system telemetry and manufacturer documentation on September 22, 2026. CZ-BRN-NEU Infrastructure Operations.