Intel Core i3-9100T Processor

CPU Desktop

Intel Core i3-9100T Processor

Exhibit Type: Desktop & Edge Hardware Specification & Architectural Dossier
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Microarchitecture: Coffee Lake Refresh (14 nm++)
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Socket: Socket LGA 1151 (LGA 1151v2 / 300 Series)
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Museum Inventory: 1 Unit (Installed in HP ProDesk 400 G5 Desktop Mini • S-Spec: SRCZX)
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Source Authority: TechPowerUp, Intel & PassMark

1. Technical Overview & Key Specifications

Category Property Specification
Processor Identity Model Name Intel® Core™ i3-9100T (SKU: CM8068403377713 • PassMark ID: 3488)
Microarchitecture Coffee Lake Refresh (9th Generation Core)
Market Segment Desktop / Ultra-Compact Form Factor (UCFF) / Energy-Efficient Edge Node
Launch Date April 23, 2019 (Q2’19 Release • Production Status: End-of-Life)
Part Numbers / S-Spec SRCZX (OEM / Tray: CM8068403377713 • Verified Museum Inventory: 1 unit)
Physical & Manufacturing CPU Socket Socket LGA 1151 (LGA 1151v2 revision, 300-series chipsets only)
Fabrication Process 14 nm++ (Intel 14-nanometer tri-gate FinFET optimization)
Transistor Count Approx. 1.75 Billion transistors (Monolithic 4-core die)
Die Size & Package Area 126 mm² die area • 37.5 × 37.5 mm LGA package envelope
Silicon Stepping B0 Stepping (Native quad-core die layout)
Thermal Junction / Case 100°C (tJMax) • 72°C (tCaseMax)
Cores & Performance Physical Cores / Threads 4 Cores / 4 Threads (1 thread per core, non-SMT design)
Base Operating Frequency 3.10 GHz
Max Turbo Boost Frequency Up to 3.70 GHz (Intel Turbo Boost Technology 2.0)
Base Clock / Multiplier 100 MHz BCLK / 31.0× (Multiplier Locked)
Bus Interconnect Speed 8.0 GT/s DMI 3.0 (Direct Media Interface to PCH)
Multi-CPU Scalability Single Socket (1S Only)
Thermal & Electrical Thermal Design Power (TDP) 35 W (T-Series Ultra-Low Power Profile)
Configurable TDP-down 25 W @ 2.40 GHz base clock
Core Voltage Range Dynamic VID (0.65 V – 1.20 V)
Cache Hierarchy Level 1 (L1) Cache 4 × 32 KB Data + 4 × 32 KB Instruction (256 KB total L1)
Level 2 (L2) Cache 4 × 256 KB dedicated unified cache (1,024 KB / 1 MB total L2)
Level 3 (L3) Cache 6 MB Intel® Smart Cache (shared pool across 4 cores, 12-way set associative)
Memory Controller Memory Architecture Dual-Channel DDR4 interface (2 memory channels, up to 2 DIMMs per channel)
Rated Memory Speed Up to DDR4-2400 MT/s
Maximum Memory Bandwidth 38.4 GB/s (At native DDR4-2400 rating)
Max Capacity & ECC Support Up to 64 GB (up to 128 GB with high-density modules) • ECC Supported: Yes
Museum Host Installed RAM 64 GB (2 × 32 GB) DDR4 SODIMM (Corsair Vengeance CMSX64GX4M2A3200C22 running at 2400 MT/s)
Expansion & Graphics PCI Express Interface PCIe 3.0 (16 Lanes from CPU: 1×16, 2×8, or 1×8 + 2×4 configurations)
Integrated Graphics Solution Intel® UHD Graphics 630 (Gen9.5 GT2, 24 Execution Units • 350 MHz base / 1100 MHz dynamic)
Display & Media Engine DisplayPort 1.2 (4K @ 60Hz), HDMI 1.4 (4K @ 24Hz) • Intel Quick Sync Video, Clear Video HD
PassMark Benchmarks Average CPU Mark (Multithread) 5,632 (Median: 5,875 across 283 samples • Personal Local Baseline: 6,109)
Single Thread Rating 2,116 MOps/Sec (PassMark PerformanceTest V10)
Desktop CPU Category Rank Rank #632 out of 1,588 Desktop CPUs in PassMark database

2. Silicon Topology & Coffee Lake Monolithic Architecture

Silicon Scale

1.75B

Transistors on monolithic 14nm++ B0 stepping die

Execution Engines

4 Cores / 4 Threads

Quad physical cores (3.10 GHz base / 3.70 GHz turbo)

Cache & Graphics

6MB L3 / UHD 630

Bi-directional ring bus + 24 EU Quick Sync graphics

Internal Silicon Die Topology & Ring Interconnect Bus

+---------------------------------------------------------------------------------------------------+
|                     INTEL CORE i3-9100T MONOLITHIC SILICON TOPOLOGY (COFFEE LAKE)                 |
|                                                                                                   |
|  +-----------------------------+  +------------------------------------------------------------+  |
|  |   INTEGRATED GRAPHICS CORE  |  |                     COMPUTE CORES & CACHE                  |  |
|  |                             |  |                                                            |  |
|  |   Intel UHD Graphics 630    |  |   +-------------+  +-------------+  +------------------+   |  |
|  |   - Gen9.5 Architecture     |  |   |   CORE 0    |  |   CORE 1    |  |  SYSTEM AGENT    |   |  |
|  |   - 24 Execution Units (EUs)|  |   | 32K+32K L1  |  | 32K+32K L1  |  | - PCIe 3.0 x16   |   |  |
|  |   - Up to 1,100 MHz Boost   |  |   |   256K L2   |  |   256K L2   |  | - DMI 3.0 link   |   |  |
|  |   - Quick Sync Video Engine |  |   +------+------+  +------+------+  +--------+---------+   |  |
|  |   - 4K Display Controller   |  |          |                |                  |             |  |
|  +--------------+--------------+  |   === ring stop ======== ring stop ====== ring stop ===+   |  |
|                 |                 |   ||     |                |                  |         ||  |  |
|                 |                 |   ||  1.5MB L3         1.5MB L3           1.5MB L3     ||  |  |
|                 |                 |   ||                                                   ||  |  |
|                 +======================>  BI-DIRECTIONAL RING INTERCONNECT (6 MB L3 POOL)  ||  |  |
|                                   |   ||                                                   ||  |  |
|                                   |   ||  1.5MB L3         1.5MB L3           1.5MB L3     ||  |  |
|                                   |   ||     |                |                  |         ||  |  |
|                                   |   === ring stop ======== ring stop ====== ring stop ===+   |  |
|                                   |          |                |                  |             |  |
|                                   |   +------+------+  +------+------+  +--------+---------+   |  |
|                                   |   |   CORE 2    |  |   CORE 3    |  | DUAL DDR4 IMC    |   |  |
|                                   |   | 32K+32K L1  |  | 32K+32K L1  |  | - 2400 MT/s Rate |   |  |
|                                   |   |   256K L2   |  |   256K L2   |  | - ECC Supported  |   |  |
|                                   |   +-------------+  +-------------+  +------------------+   |  |
|                                   +------------------------------------------------------------+  |
+---------------------------------------------------------------------------------------------------+

3. Dual-Channel DDR4 Memory & High-Speed Bus Interconnect

Integrated Dual-Channel DDR4 Controller

  • Memory Architecture: Integrated 128-bit dual-channel memory controller (2 discrete 64-bit channels).
  • Rated Speed: Officially rated up to DDR4-2400 MT/s, delivering up to 38.4 GB/s theoretical memory bandwidth.
  • Enterprise ECC Support: Full hardware Error-Correcting Code (ECC) engine supported when paired with compatible Intel workstation/server chipsets (C246).
  • Museum Host Deployment: Equipped with 64 GB (2 × 32 GB) Corsair Vengeance DDR4-3200 SODIMM modules operating at native 2400 MT/s low-power envelope.

Direct Media Interface & Expansion Fabric

  • High-Speed PCH Link: DMI 3.0 interconnect operating at 8.0 GT/s (approx. 3.93 GB/s per direction) linking the CPU directly to the Intel B360 chipset.
  • Direct PCIe Root Complex: 16 native PCI Express 3.0 lanes direct from the CPU die for high-performance discrete graphics or PCIe storage add-in cards.
  • Ultra-Low Latency Ring: Coherent ring interconnect links all 4 compute cores, 6 MB L3 cache slices, memory controller, and UHD 630 graphics with single-cycle hops.
  • Thermal Throttling Protection: Thermal Monitoring Technologies (TM1, TM2) and Digital Thermal Sensors (PECI) ensure safe operation within 35W envelope.

4. Advanced Technologies, Virtualization & Platform Security

Technology Category Feature / Instruction Set Functional Capability
Hardware Virtualization Intel® VT-x with EPT Hardware virtualization assistance with Extended Page Tables (EPT) and Virtual Processor IDs (VPID) for rapid hypervisor context switching in Proxmox VE 9.2.11
Intel® VT-d (IOMMU) Directed I/O virtualization enabling full PCI passthrough (NVMe SSDs, network NICs, iGPU) to guest virtual machines with interrupt remapping
Intel® TSX-NI Transactional Synchronization Extensions for accelerating multithreaded database operations and lock-free concurrency algorithms
Vector & Cryptographic Acceleration Intel® AES-NI & SHA Hardware-accelerated AES encryption achieving 1,734 MB/s sustained throughput for encrypted storage pools and line-rate WireGuard tunnels
AVX2 & FMA3 (256-bit SIMD) Advanced Vector Extensions 2 and Fused Multiply-Add 3 providing 256-bit floating point and integer execution for media transcoding and scientific compute
Intel® Quick Sync Video Dedicated fixed-function hardware video encoding and decoding for H.264/AVC, H.265/HEVC (8-bit and 10-bit), VP9, and VC-1 in Plex/Immich containers
Platform Security & Power Intel® SGX & OS Guard Software Guard Extensions enclave execution and Supervisor Mode Execution Protection (SMEP) preventing privilege escalation attacks
Intel® Turbo Boost 2.0 Dynamic opportunistic clock scaling boosting all active cores up to 3.70 GHz within thermal and electrical headrooms
Energy-Efficient 35W Profile T-Series low-power envelope allowing 24/7 homelab operation with minimal power draw and whisper-quiet acoustic footprint

5. PassMark Benchmark Dossier & Synthetic Performance (PerformanceTest V10)

Multithread Rating (CPU Mark)

5,632

Median: 5,875 across 283 samples • Local Host Test: 6,109

Single Thread Rating

2,116

MOps/Sec • Solid single-core response at 3.70 GHz peak boost

Data Encryption (AES-NI)

1,734

MBytes/Sec sustained hardware cryptographic rate

PassMark PerformanceTest V10 Detailed Test Suite Results

Test Suite Routine Average Result Metric Operational Context
Integer Math 14,892 MOps/Sec General OS kernel execution, database processing, and hypervisor overhead
Floating Point Math 12,886 MOps/Sec Numeric calculations, scientific modeling, and multimedia transformations
Find Prime Numbers 25 Million Primes/Sec Pure integer execution pipeline throughput and branch prediction efficiency
Random String Sorting 9,205 Thousand Strings/Sec DDR4 memory controller bandwidth and L3 cache indexing responsiveness
Data Encryption 1,734 MBytes/Sec Hardware AES-NI encrypted NVMe storage & high-throughput WireGuard tunnels
Data Compression 74,688 KBytes/Sec ZFS LZ4/ZSTD compression and Proxmox backup deduplication throughput
Physics Simulation 422 Frames/Sec Multi-threaded kinematics and vector transformation throughput
Extended Instructions 6,622 Million Matrices/Sec Intel AVX2 and FMA3 256-bit matrix vectorization throughput
Single Thread Performance 2,116 MOps/Sec Single-core Coffee Lake responsiveness at 3.70 GHz peak turbo clock

PassMark Relative Hierarchy: Desktop Energy-Efficient & Sibling Stack

Processor Model Cores / TDP Average CPU Mark Relative Variance
Intel Core i5-9400F 6C / 6T • 65W 9,463 +68.0%
Intel Core i5-9400T 6C / 6T • 35W 7,690 +36.5%
Intel Core i3-9300T 4C / 4T • 35W 5,850 +3.9%
Intel Core i3-9100T (Exhibit) 4C / 4T • 35W 5,632 Baseline (0.0%)
Intel Core i7-2600 4C / 8T • 95W 5,483 -2.6%
Intel Core i3-8100T 4C / 4T • 35W 5,340 -5.2%
Intel Core i5-4460 4C / 4T • 84W 4,916 -12.7%
Intel Core i3-7100 2C / 4T • 51W 4,308 -23.5%

6. Platform Synergy: Pairing with HP ProDesk 400 G5 Desktop Mini

Seamless Architectural Integration

The Intel Core i3-9100T is the silicon heart of the HP ProDesk 400 G5 Desktop Mini cataloged in Exhibit #2871. Paired with HP’s Mandolin-R motherboard (HP 859C) on the Intel B360 Express chipset, this compact 1-liter chassis provides dense virtualization compute at exceptional power efficiency:

Hardware Interface Intel Core i3-9100T HP ProDesk 400 G5 Desktop Mini (Post #2871)
CPU Socket & Chipset Socket LGA 1151 (LGA 1151v2) HP 859C System Board with Intel® B360 Express Chipset
Memory Architecture Dual-Channel DDR4 (up to 2400 MT/s) 64 GB DDR4-2400 SDRAM (Dual SODIMM: Corsair Vengeance 2 × 32 GB)
Storage Subsystem PCIe 3.0 root lanes & DMI 3.0 link 512 GB Kingston OM8PJP4512K3-AH0 NVMe M.2 SSD + 512 GB Verbatim Vi560 SATA SSD
Display & Media Engine Intel UHD Graphics 630 (DP 1.2 / HDMI 1.4) Dual DisplayPort 1.2 ports + 1 VGA port driving multi-monitor displays
Hypervisor Support Intel VT-x (EPT) & Intel VT-d (IOMMU) Proxmox VE 9.2.11 hypervisor node i3 hosting Immich VM 102
Power & Thermodynamics 35W Base TDP / 25W cTDP-down External 65W HP power supply (up to 89% efficiency) in 17.7 × 17.5 × 3.4 cm chassis

7. Curator’s Assessment & Homelab Applicability

  1. Museum Hardware Provenance: Mateo’s Museum archive preserves 1 verified physical unit of the Intel Core i3-9100T processor (OEM Part: CM8068403377713, S-Spec: SRCZX, B0 stepping). The processor is in active operational deployment inside the HP ProDesk 400 G5 Desktop Mini (Product: 8VR69ES#BCM, S/N: 8CC0270RP8), functioning as the authoritative Proxmox hypervisor node i3 in the CZ-BRN-NEU infrastructure cluster.
  2. Exceptional Compute-Per-Watt Profile: Operating at a strict 35 W TDP (with a 25W cTDP-down option), the i3-9100T delivers true quad-core desktop performance within a micro-chassis thermal budget. With an Average CPU Mark of 5,632 (and a local benchmark of 6,109), it comfortably outpaces previous-generation 95W quad-core CPUs such as the Core i7-2600 (5,483) and 84W Haswell Core i5-4460 (4,916).
  3. Dedicated Media & Immich Workload Node: Integrated Intel UHD Graphics 630 features Gen9.5 Quick Sync Video with native hardware decoding/encoding for HEVC (8-bit and 10-bit) and VP9. Inside Proxmox node i3, this enables GPU passthrough to Immich VM 102, accelerating photo indexing, facial recognition, and thumbnail generation with zero CPU contention.
  4. Massive 64 GB Memory Density: While standard retail specifications reference 64 GB support, the memory controller reliably operates two 32 GB Corsair Vengeance DDR4 SODIMMs in dual-channel configuration, providing ample RAM headroom for Linux kernel caching, ZFS buffers, and concurrent guest services.
  5. Enterprise Virtualization (VT-x / VT-d): Robust virtualization primitives with EPT and IOMMU allow full isolation of virtual machines and hardware passthrough of storage controllers and network adapters, making this compact Coffee Lake chip a dependable, quiet workhorse for edge infrastructure.

8. Authentic Hardware Photography & Physical Artifacts

Intel Core i3-9100T Top Heatspreader (S-Spec SRCZX)

Physical Processor Die Top • S-Spec SRCZX (3.10 GHz, Coffee Lake B0 Stepping)

Intel LGA 1151 Pinout Topology

LGA 1151 Socket Architecture & Power Pin Delivery Map

Intel Socket 1151 Physical Latch

Physical Socket 1151 Retaining Mechanism & Gold Pins

Intel Core i3-9100T Processor Specification Dossier compiled for Mateo’s Museum. Source Authority: TechPowerUp CPU Database, Intel Ark & PassMark Software.