Comprehensive hardware architecture and silicon specification dossier for the Samsung 16 GB DDR3-1600 Registered ECC RDIMM (M393B2G70DB0-YK0 / M393B2G70BH0-YK0 / M393B2G70BH0-CK0), detailing 30nm 4Gb D-die/B-die silicon, Dual-Rank (2Rx4) topology, SSTE32882 register PLL, and 72-bit SECDED ECC with Chipkill. Documents 22 museum physical units actively deployed across two production systems: 256 GB dual-socket array in Dell Precision T7610 and 96 GB (in 160 GB hybrid array) in Corsair Carbide Air 540 “Cube” on Supermicro X9SRi-F.
