Comprehensive hardware architecture and silicon specification dossier for the Samsung 16 GB DDR3-1600 Registered ECC RDIMM (M393B2G70DB0-YK0 / M393B2G70BH0-YK0), detailing 30nm 4Gb D-die/B-die silicon, Dual-Rank (2Rx4) topology, SSTE32882 register PLL, 72-bit SECDED ECC with Chipkill, and 256 GB dual-socket deployment in the Dell Precision T7610 workstation.
