RAM

Comprehensive hardware architecture and silicon specification dossier for the Samsung 16 GB DDR3-1600 Registered ECC RDIMM (M393B2G70DB0-YK0 / M393B2G70BH0-YK0 / M393B2G70BH0-CK0), detailing 30nm 4Gb D-die/B-die silicon, Dual-Rank (2Rx4) topology, SSTE32882 register PLL, and 72-bit SECDED ECC with Chipkill. Documents 22 museum physical units actively deployed across two production systems: 256 GB dual-socket array in Dell Precision T7610 and 96 GB (in 160 GB hybrid array) in Corsair Carbide Air 540 “Cube” on Supermicro X9SRi-F.

Comprehensive technical specification, silicon architecture analysis, physical hardware provenance, and live hardware telemetry for the twin SK hynix 32 GB DDR3-1333 Registered ECC RDIMM modules (HMT84GR7AMR4C-H9 / PC3-10600R-9-12-AB1). Featuring 72 discrete 4 Gb C-die DRAM slices in 36 Dual-Die Packages (DDP), Quad-Rank (4Rx4) topology, JEDEC SSTE32882 register/PLL buffer silicon, onboard TSE2002av digital thermal sensor, and factory stamped aluminum heat spreaders (SK hynix R124673H). Actively deployed in the Corsair Carbide Series Air 540 “Cube” workstation on Supermicro X9SRi-F motherboard (160.0 GB Quad-Channel ECC array, 0 EDAC errors, PassMark baseline #374140739724).

Master collection catalog and technical inventory of all RAM modules, memory kits, and historical memory architectures in Mateo’s Museum, ordered by individual module density from 32 GB DDR4 ECC and DDR5-5600 SODIMMs down to 64 KB vintage DRAM.